Siemens -- C12.pdf

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Private Communication Systems
Mobile Phones
Service Manual
for
C10 / C11 / C12
V 1.0
V 1.0
Service Manual C1x
PN MP ST
R. Fleuren
Sm_C1x_lvl2_v10_w97.doc
Page 1 of 23
09/98
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Private Communication Systems
Mobile Phones
1
Table of Contents
1 TABLE OF CONTENTS....................................................................................................................................2
2 TECHNICAL DATA...........................................................................................................................................3
3 GENERAL INFORMATION.............................................................................................................................3
4 MECHANICAL CONCEPT...............................................................................................................................4
4.1 C1X MECHANICAL DRAWING .............................................................................................................................4
4.2N ECESSARY TOOLS ...........................................................................................................................................6
4.3 D ISASSEMBLING THE C1X................................................................................................................................6
4.4 A SSEMBLING THE C1X....................................................................................................................................9
4.5 H ANDSET D ATECODES ...................................................................................................................................12
5 HARDWARE CONCEPT
.................................................................................................................................................................................12
5.1 B LOCK D IAGRAM ..........................................................................................................................................12
5.2 H ARDWARE D ESCRIPTION ...............................................................................................................................14
5.3 P OWER S UPPLY C ONCEPT ...............................................................................................................................14
5.4 O VERVOLTAGE C ONDITIONS ...........................................................................................................................16
6 SOFTWARE PROGRAMMING.....................................................................................................................17
6.1 D ESCRIPTION OF SOFTWARE BOOTING
.......................................................................................................................................................................17
6.2 L ANGUAGE G ROUPS ......................................................................................................................................17
7 BATTERY..........................................................................................................................................................18
7.1 S PECIFICATION ..............................................................................................................................................18
7.2 C HARGING ...................................................................................................................................................19
7.3 S HORT C IRCUIT P ROTECTION ...........................................................................................................................19
7.4 D EEP D ISCHARGE .........................................................................................................................................20
7.5B ATTERY D ATECODES .....................................................................................................................................21
8 UNBLOCKING .................................................................................................................................................22
8.1 S IEMENS H OTLINE .........................................................................................................................................22
8.2 I NTERNET SOLUTION .......................................................................................................................................23
V 1.0
Service Manual C1x
PN MP ST
R. Fleuren
Sm_C1x_lvl2_v10_w97.doc
Page 2 of 23
09/98
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Private Communication Systems
Mobile Phones
2
Technical Data
Length:
137 mm
Width:
55 mm
Thickness:
22 mm
Volume:
149 cm³
Weight:
165 g
Standards:
GSM Phase 2
Performance:
C10: GSM 900, Class 4 (2 Watt)
C11: GSM 1800, Class 1 (1 Watt)
C12: GSM 1900, Class 1 (1 Watt)
Power supply:
NiMH 700 mAh
Standby time:
Up to 80 hours
Talk time:
Up to 5 hours.
Charging time:
up to 7 hours (with Standard
Charger)
up to 1.5 hours (with Rapid Charger, optional)
Display:
3 lines of 12 characters each
+ 1 dedicated icon-line
SIM Card Type:
Plug-In, 3V or 5V
Antenna:
Non-retractable, Lambda/2 helix type
Accessories:
a) Standard:
Standard Charger, Battery (3.6V, 700mAh)
bI Optional:
Spare Battery, Rapid Charger, Desk Top Charger, Belt Clip,
Portable
Handsfree, Car Accessories, Travel Charger
3
General Information
V 1.0
Service Manual C1x
PN MP ST
R. Fleuren
Sm_C1x_lvl2_v10_w97.doc
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Private Communication Systems
Mobile Phones
With the C1x (C10, C11 and C12) the first series of the new C class of Siemens
Mobiles are offered to the customer. The intention of this class is to offer entry-level
mobile phones for the mass consumer market.
One of the main differences is the new type of display used: It is an alphanumeric
display which offers 3 lines of text (12 characters
each) plus a dedicated icon-line to access the
different menues.
Quick-Dial-
List
SMS
Voicemail
Ringer
Phonebook
Call List
Setup
4
Mechanical Concept
Note: All part numbers refer to mechanical drawing in section 4.1!
The mechanical concept of the C1x mobiles is similar to the one of S6 and E10.
The C1x consists of two boards, the RF & Control module (1000) and the user
interface (MMI board, 1010).
The connection between these two boards is not established by a normal connector
with plug-in contacts, but by a special interconnector (1210) embedded into a
shielding frame (1080). This interconnector is upholding the connection through the
pressure implied on it by the housing.
Caution: Be careful when assembling the interconnector. Avoid any kind of dust or
dirt because it will affect the contacts of the interconnector.
On the MMI board there are no exchangeable components. In opposite to the MMI
board of S6 and E10 there is no ringer on the MMI. The ringer (1220) is placed in the
shielding cover (1090) and connected to the RF&Control module (1000) by a plug
and a cable.
Because the Molex connector is not located at the bottom of the telephone but on it’s
top, there is no need anymore for RF cable mounted to the MMI board and for a RF
plug neither.
The antenna (1150) is not screwed into the lower case shell, but it is a plug-in type.
The keypad (1050), the loudspeaker (1140), the microphone (1130), the dust
protection frame (1070) and the display window (1060) are mounted into the upper
case shell (1020). Make sure that the microphone contact springs are not damaged
when mounting.
When turning in the screws (1160 and 1170) make sure that the right torque is used
(0.25 0.05)Nm, because this will have an effect on the contacts of the
interconnector.
4.1
C1X mechanical drawing
V 1.0
Service Manual C1x
PN MP ST
R. Fleuren
Sm_C1x_lvl2_v10_w97.doc
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Private Communication Systems
Mobile Phones
Note: The numbers shown above are NO ordering numbers. Use the numbers
supplied by your service manager for ordering!
V 1.0
Service Manual C1x
PN MP ST
R. Fleuren
Sm_C1x_lvl2_v10_w97.doc
Page 5 of 23
09/98
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