HTC Diamond.pdf

Doc. No. DOC-00040624 REV.

HTC Corporation

Issued Date

2008/4/14

A05

Revised Date 2008/6/23

Doc. Title

Diamond Service Manual

Page

1 of 109

Diamond

Service Manual

HTC Proprietary

Confidential Treatment Requested

Rev. A05

HTC Corporation

Engineering Mobility

HTC CONFIDENTIAL

SM-TP001-0704

6/30/2008 2:31:32 PM

Doc. No. DOC-00040624 REV.

HTC Corporation

Issued Date

2008/4/14

A05

Revised Date 2008/6/23

Doc. Title

Diamond Service Manual

Page

2 of 109

REVISION CONTROL TABLE

REV

DATE

CONTENTS

DEPT REVISED STAGE

AX01 2008/04/14 Fist Draft

PSE

Steven Liu

CVT

A01

2008/5/9

1. Modify product overview

2. Add RF spec

3. Add pre-load process

PSE

Steven Liu

A02

2008/5/29

1. Modify the pre-load process in chapter 4

2. Modify ESPL material P/N

3.Modify the idle current specification in the page no. 71

PSE

Steven Liu

A03

2008/6/9 Modify the pre-load process from page no. 53~56

PSE

Steven Liu

A04

2008/6/14

1. Modify the specification for G-sensor in the page no. 7

2. Remove the matrix table in the pre-load process

PSE

Steven Liu

A05

2008/6/21

1. Modify the disassembly process in page no.23, 24

and 30

2. Modify the pre-load process from page no. 53~57

3. Modify the SPL list in Chapter 9.1

4. Modify main board current leakage test procedure in

the chapter No.5

PSE

Steven Liu

HTC CONFIDENTIAL

SM-TP001-0704

6/30/2008 2:31:32 PM

Doc. No. DOC-00040624 REV.

HTC Corporation

Issued Date

2008/4/14

A05

Revised Date 2008/6/23

Doc. Title

Diamond Service Manual

Page

3 of 109

Table of Contents

1. INTRODUCTION ... ................................................................................................................................................................. 4

1.1

P RODUCT F EATURES ... ....................................................................................................................................... 5

1.2

P RODUCT OVERVIEW .... .................................................................................................................................... 12

2. DEVICE DISASSEMBLING AND ASSEMBLING PROCEDURE .... ............................................................................ 18

2.1

T OOLS L IST ... ................................................................................................................................................... 18

2.2

D ISASSEMBLING PROCEDURE ... ......................................................................................................................... 18

2.3

A SSEMBLING PROCEDURE .... ............................................................................................................................ 32

3. ROM RE-FLASH PROCEDURE .... .................................................................................................................................... 46

3.1

ROM UPGRADE THRU RUU (R E - FLASH U PGRADE U TILITY ) .... ............................................................................ 46

3.2

R OM I MAGE UPGRADE THRU SD CARD .... ........................................................................................................... 49

4. DIAGNOSTIC PROGRAM .... .............................................................................................................................................. 51

4.1

L IST OF D IAGNOSTIC / W IN CE T EST I TEMS ... ..................................................................................................... 52

5. POWER MEASUREMENT TEST .... .................................................................................................................................. 70

5.1

M AIN BOARD LEAKAGE CURRENT T EST P ROCEDURE .... ...................................................................................... 70

5.2

B ATTERY RUNDOWN TEST PROCEDURE ... ........................................................................................................... 74

6. COSMETIC INSPECTION CRITERIA .... ........................................................................................................................... 79

6.1

C LASSES DEFINITION OF INSPECTIVE AREA ... ...................................................................................................... 79

6.2

D ISPLAY INSPECTION .... .................................................................................................................................... 80

6.3

M AIN UNIT INSPECTION ... .................................................................................................................................. 81

7. GENERIC TROUBLESHOOTING .... ................................................................................................................................. 82

8. GENERIC LABELING PLAN .... .......................................................................................................................................... 87

9. GENERIC SPARE PART LIST AND PHOTOS .... ............................................................................................................ 96

9.1

SPL FOR R EPAIR ... ........................................................................................................................................... 96

9.2

B OARD L EVEL 2.5 R EPAIRS .... ........................................................................................................................ 102

10. RF ANTENNA SPECIFICATION ..... ............................................................................................................................ 108

HTC CONFIDENTIAL

SM-TP001-0704

6/30/2008 2:31:32 PM

Doc. No. DOC-00040624 REV.

HTC Corporation

Issued Date

2008/4/14

A05

Revised Date 2008/6/23

Doc. Title

Diamond Service Manual

Page

4 of 109

1. Introduction

This manual provides the technical information to support the service activities of Diamond.

This document contains highly confidential information, so any or all of this document should not be revealed to

any third party.

z Chapter 1: Introduction-This Chapter is about Products features and basic Product

function. After reading this chapter, you will know what feature the product has

and basic hardware operation. Also you will know how to perform soft-rest and

hard-rest in this chapter.

z Chapter 2: Device Dissembling and Assembling Procedure- After reading this chapter,

you will learn how to disassemble and assemble the product. Also, you will

know what tools to use and the torque. Please follow the instruction to

dissemble the unit to prevent from damaging the unit.

z Chapter 3: ROM Re-flash Procedure- After reading this chapter, you will learn how to

perform the ROM image re-flesh by using RUU and SD-Card. Also you can

find the steps of enter the boot loader mode.

z Chapter 4: DIAGNOSTIC PROGRAM- After reading this chapter, you will learn

z How to use the diagnostic program to perform unit function test

z How to test some functions in Windows Mobile mode (ex. WLAN,

Bluetooth, and USB etc…)

z Chapter 5: Power measurement test- After reading this chapter, you will learn how to use

MB leakage test procedure and battery run-down test (Battery Capacity

Measurement).

z Chapter 6: Cosmetic Inspection Criteria- After reading this chapter you will learn the

appearance quality inspection criteria, ex. Display, bezel, and housing etc…

z Chapter 7: Generic Troubleshooting- After reading this chapter, you will learn how to do

generic trouble-shooting.

z Chapter 8: Generic Labeling Plan- In this chapter, you will find generic labels for

reference, ex. Regulation label, and battery label etc…

z Chapter 9: Generic Spare Part List and Photos- In this chapter, you will find Spar parts

reference list and photos for repairing, including unit and Board level.

z Chapter 10: RF Antenna Specification- Reference Spec for RF test.

HTC CONFIDENTIAL

SM-TP001-0704

6/30/2008 2:31:32 PM

Doc. No. DOC-00040624 REV.

HTC Corporation

Issued Date

2008/4/14

A05

Revised Date 2008/6/23

Doc. Title

Diamond Service Manual

Page

5 of 109

1.1 Product Features

Platform

DPA/UMTS

ra slim bar type PDA phone form factor

0: 824-849 MHz, 869-894 MHz (Band V)

crosoft Windows Mobile 6.1 professional

900: 880-915 MHz, 925-960 MHz (Band VIII)

00:1850-1910MHz, 1930-1990MHz (Band II)

Dimension

00:1920-1980MHz, 2110-2170MHz (Band I)

2 mm(L) x 51 mm(W) x 11.5 mm(T)

GSM/GPRS/EDGE Tri-band

[W/ 900mAH battery]

0: 824-849, 869-894MHz

0: 880-915, 925-960MHz

Processor/Chipset

00: 1710-1785, 1805-1880MHz

alcomm MSM 7201A, 528 MHz

00: 1850-1910, 1930-1990MHz

DPA / UMTS

Memory

3GPP Release 5 compliant

ROM: 256 MB (for programs and users’ storage)

Up to 3.6/7.2Mbps peak rate

ND: 4 GB

UPA [Option, depends on carrier engagement]

RAM: 196 MB DDR RAM (include 64MB memory in

Category 5, 2Mbps

baseband)

Concurrent: DL up to 3.6Mbs and UL up to 2Mbps

bal roaming

LCD Module

nd switching

2.8" VGA dots resolution

over and cell selection between

-color TFT LCD with LED back light

GSM/GPRS/EDGE and UMTS

uch Screen

DTM

SAIC (circuit switch only)

HSDPA/WCDMA/EDGE/GPRS/GSM Function

alizer (HSDPA channels only)

Internal antenna

o codec: AMR-NB, AMR-WB, EFR, FR, HR

DPA/UMTS (2100/900 MHz for EU, Asia and

SMS (MO, MT), concatenated SMS (640

Softbank, 850/1900 for US, Latin America SKU3,

characters)

2100/850 for Telstra, Latin America SKU1&SKU2)

port MCC-MNC-UC-ID as stated in 3GPP TS

and GSM/GPRS/EDGE Tri-band

25.401 R99, section 6, for both RIL and radio

(900/1800/1900Mhz for EU, Asia, Softbank, E-Mobile,

neric services:

Telstra, Latin America SKU2 and 850/1800/1900 for

Call holding/waiting/forwarding

US, Latin America SKU1&3)

Call barring

HTC CONFIDENTIAL

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6/30/2008 2:31:32 PM

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