Kaiser.pdf

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Doc. No. DOC-00030262 REV.
High Tech Computer, Corp.
Issued Date 2008/02/01
A02
.
Revised Date
Doc. Title
Kaiser Service Manual
Page
1 of 94
Kaiser
Service Manual
HTC Proprietary
Confidential Treatment Requested
Rev. A02
HTC Corp.
Engineering Mobility
HTC CONFIDENTIAL
SM-TP001-0704
U
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Doc. No. DOC-00030262 REV.
High Tech Computer, Corp.
Issued Date 2008/02/01
A02
.
Revised Date
Doc. Title
Kaiser Service Manual
Page
2 of 94
REVISION CONTROL TABLE
REV
DATE
CONTENTS
DEPT REVISED STAGE
AX01 2007/06/07 Fist Draft
PSE Justin_Hsu
CVT
A01
2007/08/31
1. Modify product overview
2. include warranty and LDI label to label plan
3. Add RF spec
PSE Justin_Hsu
MV
A02
2007/11/26
1. Add 2.3 Assembly Tips
2. Correct Screw P/N to 72H02293-00M in 9.1
SPL for repair
3. Add 5.1 Main board leakage current test procedure
PSE Steven_Liu
MV
A03
2008/2/1
1. Add repair notice for Qwerty keypad assembly
procedure in page 33
2. Add TOPPOLY LCD into assembly tips in page 38
3. Modify SPL note and photo for adding
Refurbishment item
PSE Steven_Liu
MV
HTC CONFIDENTIAL
SM-TP001-0704
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Doc. No. DOC-00030262 REV.
High Tech Computer, Corp.
Issued Date 2008/02/01
A02
.
Revised Date
Doc. Title
Kaiser Service Manual
Page
3 of 94
1. INTRODUCTION ... ................................................................................................................................................................. 4
Table of Contents
1.1 P RODUCT F EATURES .. ..................................................................................................................................................... 5
1.2 P RODUCT OVERVIEW .. ................................................................................................................................................... 11
2. DEVICE DISASSEMBLING AND ASSEMBLING PROCEDURE ... ............................................................................. 18
2.1 D ISASSEMBLING PROCEDURE .. ...................................................................................................................................... 18
2.2 A SSEMBLING PROCEDURE .. ........................................................................................................................................... 27
2.3 A SSEMBLY T IPS ... ........................................................................................................................................................... 38
3. ROM RE-FLASH PROCEDURE ... ..................................................................................................................................... 40
3.1 ROM UPGRADE THRU RUU (R E - FLASH U PGRADE U TILITY ) .. ...................................................................................... 40
3.2 R OM I MAGE UPGRADE THRU SD CARD .. ........................................................................................................................ 43
4. DIAGNOSTIC PROGRAM ... ............................................................................................................................................... 45
4.1 L IST OF D IAGNOSTIC / W IN CE T EST I TEMS ... ............................................................................................................... 45
5. POWER MEASUREMENT TEST ... ................................................................................................................................... 55
5.1 M AIN BOARD LEAKAGE CURRENT T EST P ROCEDURE .. ................................................................................................. 55
5.2 B ATTERY RUNDOWN TEST PROCEDURE ... ...................................................................................................................... 59
6. COSMETIC INSPECTION CRITERIA ... ............................................................................................................................ 64
6.1 C LASSES DEFINITION OF INSPECTIVE AREA .. ................................................................................................................. 64
6.2 D ISPLAY INSPECTION .. ................................................................................................................................................... 65
6.3 M AIN UNIT INSPECTION ... ............................................................................................................................................... 65
7. GENERIC TROUBLESHOOTING ... .................................................................................................................................. 66
8. GENERIC LABELING PLAN ... ........................................................................................................................................... 71
9. GENERIC SPARE PART LIST AND PHOTOS ... ............................................................................................................. 82
9.1 SPL FOR R EPAIR .. ......................................................................................................................................................... 82
9.2 B OARD L EVEL 2.5 R EPAIRS ... ........................................................................................................................................ 88
10. RF ANTENNA SPECIFICATION ... ................................................................................................................................ 93
10.1 EU A NTENNA .. ............................................................................................................................................................... 93
10.2 US A NTENNA .. ............................................................................................................................................................... 94
HTC CONFIDENTIAL
SM-TP001-0704
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Doc. No. DOC-00030262 REV.
High Tech Computer, Corp.
Issued Date 2008/02/01
A02
.
Revised Date
Doc. Title
Kaiser Service Manual
Page
4 of 94
1. Introduction
This manual provides the technical information to support the service activities of Kaiser.
This document contains highly confidential information, so any or all of this document should not be revealed to
any third party.
z Chapter 1: Introduction-This Chapter is about Products features and basic Product function. After
reading this chapter, you will know what feature the product has and basic hardware
operation. Also you will know how to perform soft-rest and hard-rest in this chapter.
z Chapter 2: Device Dissembling and Assembling Procedure- After reading this chapter, you will
learn how to disassemble and assemble the product. Also, you will know what tools to
use and the torque. Please follow the instruction to dissemble the unit to prevent from
damaging the unit.
z Chapter 3: ROM Re-flash Procedure- After reading this chapter, you will learn how to perform
the ROM image re-flesh by using RUU and SD-Card. Also you can find the steps of
enter the boot loader mode.
z Chapter 4: DIAGNOSTIC PROGRAM- After reading this chapter, you will learn
z How to use the diagnostic program to perform unit function test
z How to test some functions in Windows Mobile mode (ex. WLAN, Bluetooth, and
USB etc…)
z Chapter 5: Power measurement test- After reading this chapter, you will learn how to use MB
leakage test procedure and battery run-down test (Battery Capacity Measurement).
z Chapter 6: Cosmetic Inspection Criteria- After reading this chapter you will learn the appearance
quality inspection criteria, ex. Display, bezel, and housing etc…
z Chapter 7: Generic Troubleshooting- After reading this chapter, you will learn how to do generic
trouble-shooting.
z Chapter 8: Generic Labeling Plan- In this chapter, you will find generic labels for reference, ex.
Regulation label, and battery label etc…
z Chapter 9: Generic Spare Part List and Photos- In this chapter, you will find Spar parts reference
list and photos for repairing, including unit and Board level.
z Chapter 10: RF Antenna Specification- Reference Spec for RF test.
HTC CONFIDENTIAL
SM-TP001-0704
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Doc. No. DOC-00030262 REV.
High Tech Computer, Corp.
Issued Date 2008/02/01
A02
.
Revised Date
Doc. Title
Kaiser Service Manual
Page
5 of 94
1.1 Product Features
Platform
800/1700/2100Mhz for Japan) and
z PDA form factor integrated dual modes
GSM/GPRS/EDGE quad band
WCDMA/HSDPA and quad-band GSM/EDGE,
(850/900/1800/1900)
Bluetooth, WiFi, mega-pixel camera, and one
z HSDPA / UMTS
stop sliding QWERTY keyboard with 45 degree
3GPP Release 5 compliant
flip up display
UE category 6, QPSK, 3.6Mbps peak rate
z Microsoft Windows 6 Professional
Concurrent: DL up to 1.8Mbps and UL up
to 384Kbps
Dimension
z Global roaming
z 112 mm(L) x 59 mm(W) x 18.65 / 19.55mm
z Auto band switching
around antenna (T)
z Handover and cell selection between
z 190 g with battery pack
GSM/EDGE and WCDMA
z DTM
Processor/Chipset
z SAIC(Circuit-Switch only)
z Qualcomm MSM 7200, 400Mhz
z Equalizer (HSDPA channels only)
z Audio codec: AMR, EFR, FR, HR
Memory
z SMS (MO, MT), concatenated SMS (640
z ROM: 256 MB (for programs and users’
characters)
storage)
z Supplement services:
z RAM: 64 or 128 MB DDR RAM
Call holding/waiting/forwarding
Call barring
LCD Module
CLI (Calling Line Identity)
z 2.8" QVGA (or VGA[TBD]) dots resolution
Display own number
z 65K-color TFT LCD with LED back light
Network selection
z Sensitive Touch Screen
Cell broadcast
Multi-party conference call
WCDMA/HSDPA (available when
Spool icon
ready)/GSM/EDGE Function
Phase 2+ unstructured supplementary
z Internal antenna
service data
z Dual-mode, HSDPA/UMTS (2100MHz for
Network Lock
Europe, 850/1900/2100MHz for Cingular and
CPHS (partial support)
HTC CONFIDENTIAL
SM-TP001-0704
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