FinePix6900ZOOM SCHEMATICS.pdf

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FinePix6900Zoom Schematics
DIGITAL CAMERA
FinePix6900ZOOM
SCHEMATICS
U/E/EG-Model
WARNING
THE COMPONENTS INDENTIFIED BY MARK IN THE PARTS LIST SHOULD BE REPLACED
ONLT BY THE COMPONENTS SPECIFIED IN THE PARTS LIST.
RISK OF FIRE AND ELECTRIC SHOCK.
FUJI PHOTO FILM CO., LTD.
Ref.No.:ZM00369-200
Printed in Japan 2001.5(NT)
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FinePix6900ZOOM(U/E/EG) SCHEMATICS
SAFETY CHECK-OUT
After correcting the original problem, perform the following
safety check before return the product to the costomer.
1. Check the area of your repair for unsoldered or
poorly soldered connections. Check the entire
board surface for solder splasher and bridges.
5.
Caution:
For continued protection against
fire hazard, replace only with same
type 2.5 amperes 125/250 volts
fuse.
Attention:
Afin d’assurer une protection
permanente contre les risques
d’incendie, remplacer uniquement
par un fusible de meme, type 2.5
amperes, 125/250 volts.
RISK OF FIRE-
REPLACE FUSE
AS MARKED
2.5A 125/250V
2. Check the interboard wiring to ensure that no
wires are “pinched” or contact high-wattage
resistors.
2.5A 125/250V
3. Look for unauthorized replacement parts, particu-
larly transistors, that were installed during a
previous repair. Point them out to the customer
and recommend their replacement.
6.
Warning:
To reduce the electric shock, be
careful to touch the parts.
4. Look for parts which, though functioning, show
obvious signs of deterioration. Point them out to
the customer and recommend their replacement.
WARNING!
HIGH VOLTAGE
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FinePix6900ZOOM(U/E/EG) SCHEMATICS
TABLE OF CONTENTS
TABLE OF CONTENTS
page
3.Schematics
3-2.MAIN PWB ASSY
3-3.DCST PWB ASSY
3-4.KEY PWB ASSY
3-5.CCD PWB ASSY
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1.Notes on Schematics Diagrams
FinePix6900ZOOM(U/E/EG) SCHEMATICS
1.Notes on Schematics Diagrams
Other neccessary notes are shown in each block.
1-1.Cautions
Caution when replaceing chip (leadless) parts.
* Do not re-use the removed parts, but use new parts.
Be careful that the negativ side of the tantalum capacitors are susceptible to heat.
* Voltage indications are omitted for capacitors other than chemical and tantalum capacitors with a dielectric strength of
50 V or less.All units are uF (p shows pF).
* Chip resistors without indication are 1/10 W.
* k=1000 , M=1000 k
* Variable resistors and semi-variable resistor are abbreviated the specification of B characteristic.
2.Basic Block Diagram
2-1.Overview of Functions of Each Circuit
Board Name
Circuit Diagram Name
Circuit Functions
MAIN PWB ASSY
Cam Block Schematic
A/D conversion of CCD output signal
Video signal prosess circuit Schematic
System control circuit
Video signal prosess / Video output /
Serial Communication circuit
LCD Block Schematic
Control of LCD panel circuit
DCST PWB ASSY
DC/DC, Flash Block Schematic
Power supply / Control off Flash /
LCD back light inverter circuit
KEY PWB ASSY
SW Block Schematic
Control switch circuit
CCD PWB ASSY
CCD Block Schematic
CCD output circuit
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FinePix6900ZOOM(U/E/EG) SCHEMATICS
2.Basic Block Diagram
2-2.Description of Block Functions
2-2-1.Overview of New Technology
Basic block functions are almost the same as those of the FinePix4900ZOOM. Differences in block function from those of the
FinePix4900ZOOM are the following two points.
1. This is a newly developed CCD (1/1.7" approx. 3.3-million-pixel reading honeycomb CCD sensor, employing an RGB primary-
color filter [honeycomb array]), and it enables creation of image files with the equivalent of over 6 million pixels through us in
combination with the mechanical shutter and through honeycomb signal processing.
2. The picture quality of a high resolution of 6,000,000-pixel output is decreased by adopting new IC(SCS3D_IC) and the noise
of low brightness is decreased without ruining a high luminance resolution by the core ring setting according to brightness.
2-2-2.Description of the Block Functions in the MAIN PWB UNIT
(1)Description of Camera Circuit Block Functions (CAM BLOCK)
Analog video signals output from the newly developed CCD (1/1.7", approx. 3.3 million pixels) undergo pseudocolor compen-
sation processing, applied interpolation processing, amplification, and signal mixing in the SCS3A_IC (IC107: CSP_IC) , and
thereafter are converted to 12-bit digital signals. The converted digital signals are sent to the single-chip SCS2D_IC (IC308:
CSP_IC) . ( CSP_IC = C h ip S i ze P a ckage IC )
(2)Description of the Image Signal Processing Block (PROCESS BLOCK)
Input Data from the CCD
* The 12bit digital image data (a portion equivalent to 1 H) output from the camera block (CAM BLOCK) is sent to the
SCS2D_IC , buffer processing is performed in the [internal buffer] of this IC, and replacement with 32bit (16bit x2) data is
performed. The replaced 32bit image data passed through the [DMA unit] and the [internal bus controller] in the SCS2D_IC ,
then is stored in the SDRAM_ICs (IC307 and 310: 16 MB) . Image data equivalent to one frame (2,400 pixels x 900 lines) is
temporarily stored in the SDRAM ICs .
* At the same time, the AE is added in the [AUTO arithmetic unit] utilizing the 12bit image data input to the SCS2D_IC , and
required data for AE, AWB, and AF is sent to the internal DRAM. In the internal DRAM, serial data transfer to the SCS3A_IC
is performed so that the appropriate AE, AWB, and AF are obtained.
Processing for recording to the SSFDC
The image data stored in SDRAM_IC is sent to SCS3D_IC(IC301) by one line. The image data *1 converted by SCS3D_IC is
sent to SDRAM_IC again. The image data stored in SDRAM_IC is sent to SCS2D_IC once, compressed by the [JPEG
operation part] in SCS2D_IC , and stored in SDRAM_IC again. The image data after compresses is recorded in SSFDC one
by one via the [Media controller] in SCS2D_IC .
*1 The image processing with SCS3D_IC converts the image data sent from SDRAM_IC into 32bit->12bit with a internal buffer,
and processes the signal. After the image data of 12bit is converted into the Y/C signal of each 8bit, the image data is sent to
a internal buffer again in this signal processing. The Y/C signal of each 8bit is converted into the Y/Y/Cb/Cr signal of each
8bit in a internal buffer, and are send to the SDRAM_IC . In addition, this IC also controls the USB control.
Playback of Images from the SSFDC
Compressed image data from the SSFDC is sent to the SCS2D_IC , and is stored, via the [media controller], in the
SDRAM_IC . The compressed image data stored in the SDRAM_IC is expanded by the [JPEG arithmetic unit], and is again
stored in the SDRAM_IC . The image data after expansion is sent via the [internal buffer] to the [signal processing unit]. In
the [signal processing unit], the respective 8-bit Y, Y, Cb, and Cr signals undergo processing for conversion to brightness
signals and color differential signals, pass through the [VRAM controller], [encoder], and [D/A converter], undergo digital-to-
analog conversion and character-generator superimposition, and become analog R, G, and B signals. At the same time, a
VBS signal is also incorporated in the B signal of the R, G, and B signals.
During Movie Imaging Mode
The 12-bit image data from the camera block (CAM BLOCK) passes from the [internal buffer] to the [signal processing unit] in
the SCS2D_IC . In the [signal processing unit], the 12-bit image data is converted to respective 8-bit Y and C signals, and is
sent to the internal VRAM (1 MB) in the [VRAM controller]. The image data stored in the VRAM is sent to the SDRAM_IC .
The image data stored in the SDRAM_IC is compressed by the [JPEG arithmetic unit] in the SCS2D_IC , and is again stored
in the SDRAM_IC . The image data after compression is sequentially recorded, via the [media controller] in the SCS2D_IC , to
the SSFDC.
Camera-related adjustment data is stored in the EEPROM (IC311) .
(3)Description of LCD Control Block Functions (LCD CONTROL BLOCK)
Analog R, G, and B signals processed in the image signal-processing SCS2D_IC are sent to the LCD control IC (IC202) , and
are output to the LCD panel. In addition, this IC also controls the tone of the liquid-crystal panel.
The liquid-crystal monitor that is used (2" type; 130,000 pixels) employs the low-temperature polysilicon TFT LCD used in the
FinePix 2700.
2-2-3.Description of the Functions of the DCST Circuit Board
The power-supply circuit provided on the DCST circuit board generates power supplies of -8 V/16 V (for CCD drive), 2.5 V
(for the SCS2D_IC), 3.3 V (for the SCS3A_IC, SCS2D_IC, SCS3D_IC, SDRAM_IC, ROM_IC, LEDs, and keys), 5.0 V (for
lens drive, flash, and LCD backlight), 12 V (for LCD control), and so on.
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