1N4001G_1.pdf

(40 KB) Pobierz
Rectifiers
DISCRETE SEMICONDUCTORS
DATA SHEET
handbook, 2 columns
M3D116
1N4001G to 1N4007G
Rectifiers
Product specication
Supersedes data of April 1992
1996 May 24
22884333.050.png
Philips Semiconductors
Product specication
Rectiers
1N4001G to 1N4007G
FEATURES
DESCRIPTION
This package is hermetically sealed
and fatigue free as coefficients of
expansion of all used parts are
matched.
·
Glass passivated
Rugged glass package, using a high
temperature alloyed construction.
·
High maximum operating
temperature
·
Low leakage current
·
Excellent stability
2/3 page (Datasheet)
k
a
·
Available in ammo-pack.
MAM047
Fig.1 Simplified outline (SOD57) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V RRM
repetitive peak reverse voltage
1N4001G
-
50
V
1N4002G
-
100
V
1N4003G
-
200
V
1N4004G
-
400
V
1N4005G
-
600
V
1N4006G
-
800
V
1N4007G
-
1000
V
V R
continuous reverse voltage
1N4001G
-
50
V
1N4002G
-
100
V
1N4003G
-
200
V
1N4004G
-
400
V
1N4005G
-
600
V
1N4006G
-
800
V
1N4007G
-
1000
V
I F(AV)
average forward current
averaged over any 20 ms
period; T amb =75
-
1.00 A
C; see Fig.2
averaged over any 20 ms
period; T amb = 100
-
0.75 A
°
C; see Fig.2
I F
continuous forward current
T amb =75
C; see Fig.2
-
1.00 A
I FRM
repetitive peak forward current
-
10
A
I FSM
non-repetitive peak forward current
half sinewave; 60 Hz
-
30
A
T stg
storage temperature
- 65
+175
° C
T j
junction temperature
- 65
+175
° C
1996 May 24
2
°
°
22884333.060.png 22884333.071.png
Philips Semiconductors
Product specication
Rectiers
1N4001G to 1N4007G
ELECTRICAL CHARACTERISTICS
T j =25 ° C; unless otherwise specied.
SYMBOL
PARAMETER
CONDITIONS
MAX.
UNIT
V F
forward voltage
I F = 1 A; see Fig.3
1.1 V
V F(AV)
full-cycle average forward voltage
I F(AV) = 1 A
0.8 V
I R
reverse current
V R =V Rmax
10
m A
V R =V Rmax ; T amb = 100
°
C
50
m
A
I R(AV)
full-cycle average reverse current
V R =V RRMmax ; T amb =75
°
C
30
m
A
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
R th j-tp
thermal resistance from junction to tie-point
lead length = 10 mm
46
K/W
R th j-a
thermal resistance from junction to ambient
note 1
100
K/W
Note
1. Device mounted on epoxy-glass printed-circuit board, 1.5 mm thick; thickness of copper ³ 40 m m, see Fig.4.
For more information please refer to the “General Part of associated Handbook”.
1996 May 24
3
22884333.073.png 22884333.001.png
Philips Semiconductors
Product specication
Rectiers
1N4001G to 1N4007G
GRAPHICAL DATA
10
MBH385
handbook, halfpage
MBH386
1.5
handbook, halfpage
I F
(A)
I F
(A)
1
1
0.5
(1)
(2)
(3)
10 - 1
0
0.5
1
1.5
V F (V)
0
0
100
T amb ( ° C)
200
(1) T amb = 100 ° C.
(2) T amb = 20
°
C.
(3) T amb =
-
50
°
C.
Fig.2 Maximum forward current as a function of
ambient temperature.
Fig.3 Forward current as a function of forward
voltage; typical values.
handbook, halfpage
50
25
7
50
2
3
MGA200
Dimensions in mm.
Fig.4 Device mounted on a printed-circuit board.
1996 May 24
4
22884333.002.png 22884333.003.png 22884333.004.png 22884333.005.png 22884333.006.png 22884333.007.png 22884333.008.png 22884333.009.png 22884333.010.png 22884333.011.png 22884333.012.png 22884333.013.png 22884333.014.png 22884333.015.png 22884333.016.png 22884333.017.png 22884333.018.png 22884333.019.png 22884333.020.png 22884333.021.png 22884333.022.png 22884333.023.png 22884333.024.png 22884333.025.png 22884333.026.png 22884333.027.png 22884333.028.png 22884333.029.png 22884333.030.png 22884333.031.png 22884333.032.png 22884333.033.png 22884333.034.png 22884333.035.png 22884333.036.png 22884333.037.png 22884333.038.png 22884333.039.png 22884333.040.png 22884333.041.png 22884333.042.png 22884333.043.png 22884333.044.png 22884333.045.png 22884333.046.png 22884333.047.png 22884333.048.png
 
22884333.049.png
 
22884333.051.png
Philips Semiconductors
Product specication
Rectiers
1N4001G to 1N4007G
PACKAGE OUTLINE
handbook, full pagewidth
k
a
0.81
max
3.81
max
28 min
4.57
max
28 min
MBC880
Dimensions in mm.
Fig.5 SOD57.
DEFINITIONS
Data sheet status
Objective specication
This data sheet contains target or goal specications for product development.
Preliminary specication
This data sheet contains preliminary data; supplementary data may be published later.
Product specication
This data sheet contains nal product specications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specication
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specication.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1996 May 24
5
22884333.052.png 22884333.053.png 22884333.054.png 22884333.055.png 22884333.056.png 22884333.057.png 22884333.058.png 22884333.059.png 22884333.061.png 22884333.062.png 22884333.063.png 22884333.064.png 22884333.065.png 22884333.066.png 22884333.067.png 22884333.068.png 22884333.069.png 22884333.070.png 22884333.072.png

Plik z chomika:

Inne pliki z tego folderu:

Inne foldery tego chomika:

Zgłoś jeśli naruszono regulamin