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SEMICONDUCTOR TECHNICAL DATA
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by 2N4264/D
NPN Silicon
COLLECTOR
3
2
BASE
1
EMITTER
1
2
3
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
CASE 29–04, STYLE 1
TO–92 (TO–226AA)
Collector – Emitter Voltage
V
CEO
15
Vdc
Collector – Base Voltage
V
CBO
30
Vdc
Emitter – Base Voltage
V
EBO
6.0
Vdc
Collector Current — Continuous
I
C
200
mAdc
Total Device Dissipation @ T
A
= 25
°
C
Derate above 25
°
C
P
D
350
2.8
mW
mW/
°
C
Total Device Dissipation @ T
C
= 25
°
C
Derate above 25
°
C
P
D
1.0
8.0
Watts
mW/
°
C
Operating and Storage Junction
Temperature Range
T
J
, T
stg
– 55 to +150
°
C
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Thermal Resistance, Junction to Ambient
R
JA
357
°
C/W
Thermal Resistance, Junction to Case
R
JC
125
°
C/W
ELECTRICAL CHARACTERISTICS
(T
A
= 25
°
C unless otherwise noted)
Characteristic
Symbol
Min
Max
Unit
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage
(I
C
= 1.0 mAdc, I
B
= 0)
V
(BR)CEO
Vdc
15
—
Collector – Base Breakdown Voltage
(I
C
= 10
Adc, I
E
= 0)
V
(BR)CBO
Vdc
30
—
Emitter – Base Breakdown Voltage
(I
E
= 10
Adc, I
C
= 0)
V
(BR)EBO
Vdc
6.0
—
Base Cutoff Current
(V
CE
= 12 Vdc, V
EB(off)
= 0.25 Vdc)
(V
CE
= 12 Vdc, V
EB(off)
= 0.25 Vdc, T
A
= 100
°
C)
I
BEV
m
Adc
—
—
0.1
10
Collector Cutoff Current
(V
CE
= 12 Vdc, V
EB(off)
= 0.25 Vdc)
I
CEX
nAdc
—
100
REV 2
Motorola Small–Signal Transistors, FETs and Diodes Device Data
1
W
Motorola, Inc. 1997
ELECTRICAL CHARACTERISTICS
(T
A
= 25
°
C unless otherwise noted) (Continued)
Characteristic
Symbol
Min
Max
Unit
ON CHARACTERISTICS
DC Current Gain
(I
C
= 1.0 mAdc, V
CE
= 1.0 Vdc)
(I
C
= 10 mAdc, V
CE
= 1.0 Vdc)
(I
C
= 10 mAdc, V
CE
= 1.0 Vdc, T
A
= – 55
°
C)
(I
C
= 30 mAdc, V
CE
= 1.0 Vdc)
(I
C
= 100 mAdc, V
CE
= 1.0 Vdc)
(1)
(I
C
= 200 mAdc, V
CE
= 1.0 Vdc)
(1)
h
FE
—
25
40
20
40
30
20
—
160
—
—
—
—
Collector – Emitter Saturation Voltage
(I
C
= 10 mAdc, I
B
= 1.0 mAdc)
(I
C
= 100 mAdc, I
B
= 10 mAdc)
(1)
V
CE(sat)
Vdc
—
—
0.22
0.35
Base – Emitter Saturation Voltage
(I
C
= 10 mAdc, I
B
= 1.0 mAdc)
(I
C
= 100 mAdc, I
B
= 10 mAdc)
(1)
V
BE(sat)
Vdc
0.65
0.75
0.8
0.95
SMALL– SIGNAL CHARACTERISTICS
Current – Gain — Bandwidth Product
(I
C
= 10 mAdc, V
CE
= 10 Vdc, f = 100 MHz)
f
T
300
—
MHz
Input Capacitance
(V
EB
= 0.5 Vdc, I
C
= 0, f = 1.0 MHz)
C
ibo
—
8.0
pF
Output Capacitance
(V
CB
= 5.0 Vdc, I
E
= 0, f = 1.0 MHz, I
E
= 0)
C
obo
—
4.0
pF
SWITCHING CHARACTERISTICS
Delay Time
(V
CC
= 10 Vdc, V
EB(off)
= 2.0 Vdc,
t
d
—
8.0
ns
(
CC
,
EB(off)
,
I
C
= 100 mAdc, I
B1
= 10 mAdc) (Fig. 1, Test Condition C)
Rise Time
t
r
—
15
ns
Storage Time
V
CC
= 10 Vdc, (I
C
= 10 mAdc, for t
s
)
(I
C
= 100 mA for t
f
)
t
s
—
20
ns
(I
C
= 100 mA for t
f
)
(I
B1
= –10 mA) (I
B2
= 10 mA) (Fig. 1, Test Condition C)
Fall Time
t
f
—
15
ns
Turn–On Time
(V
CC
= 3.0 Vdc, V
EB(off)
= 1.5 Vdc,
I
C
= 10 mAdc, I
B1
= 3.0 mAdc) (Fig. 1, Test Condition A)
t
on
—
25
ns
Turn–Off Time
(V
CC
= 3.0 Vdc, I
C
= 10 mAdc,
I
B1
= 3.0 mAdc, I
B2
= 1.5 mAdc) (Fig. 1, Test Condition A)
t
off
—
35
ns
Storage Time
(V
CC
= 10 Vdc, I
C
= 10 mA,
I
B1
= I
B2
= 10 mAdc) (Fig. 1, Test Condition B)
t
s
—
20
ns
Total Control Charge
(V
CC
= 3.0 Vdc, I
C
= 10 mAdc, I
B
= mAdc)
(Fig. 3, Test Condition A)
Q
T
—
80
pC
1. Pulse Test: Pulse Width = 300
s, Duty Cycle = 2.0%.
Figure 1. Switching Time Equivalent Test Circuit
Test
Condition I
C
V
CC
t
on
t
1
t
off
t
1
V
CC
R
S
W
3300
560
560
R
C
270
960
96
C
S(max)
pF
4
4
12
V
BE(off)
V
–1.5
—
–2.0
V
1
V
10.55
—
6.35
V
2
V
–4.15
–4.65
–4.65
V
3
V
10.70
6.55
6.55
R
C
mA
10
10
100
V
3
10
10
V
1
V
3
R
B
0
0
V
2
A
B
C
V
EB(off)
C
S
<2 ns
<2 ns
PULSE WIDTH (t
1
) = 300 ns DUTY CYCLE = 2%
2
Motorola Small–Signal Transistors, FETs and Diodes Device Data
CURRENT GAIN CHARACTERISTICS
100
70
2N4264
V
CE
= 1 V
50
T
J
= 125
°
C
25
°
C
30
–15
°
C
–55
°
C
20
10
1.0
2.0
3.0
5.0
7.0
10
20
30
50
70
100
200
I
C
, COLLECTOR CURRENT (mA)
Figure 2. Minimum Current Gain
270
W
3 V
t
1
8 pF
C < C
OPT
+10 V
C = 0
D
V
0
C
S
< 4 pF
C
C
OPT
<1 ns
9.2 k
W
PULSE WIDTH (t
1
) = 5
m
s DUTY CYCLE = 2%
TIME
Figure 3. Q
T
Test Circuit
Figure 4. Turn–Off Waveform
NOTE 1
When a transistor is held in a conductive state by a base current, I
B
,
a charge, Q
S
, is developed or “stored” in the transistor. Q
S
may be
written: Q
S
= Q
1
+ Q
V
+ Q
X
.
Q
1
is the charge required to develop the required collector current.
This charge is primarily a function of alpha cutoff frequency. Q
V
is the
charge required to charge the collector–base feedback capacity. Q
X
is
excess charge resulting from overdrive, i.e., operation in saturation.
The charge required to turn a transistor “on” to the edge of saturation
is the sum of Q
1
and Q
V
which is defined as the active region charge,
Q
A
. Q
A
= I
B1
t
r
when the transistor is driven by a constant current step
(I
B1
) and I
B1
< <
I
C
h
FE
.
If I
B
were suddenly removed, the transistor would continue to
conduct until Q
S
is removed from the active regions through an
external path or through internal recombination. Since the internal
recombination time is long compared to the ultimate capability of a
transistor, a charge, Q
T
, of opposite polarity, equal in magnitude, can
be stored on an external capacitor, C, to neutralize the internal charge
and considerably reduce the turn–off time of the transistor. Figure 3
shows the test circuit and Figure 4 the turn–off waveform. Given Q
T
from Figure 13, the external C for worst–case turn–off in any circuit is:
C = Q
T
/
D
V, where
D
V is defined in Figure 3.
Motorola Small–Signal Transistors, FETs and Diodes Device Data
3
“ON” CONDITION CHARACTERISTICS
1.0
0.8
2N4264
T
J
= 25
°
C
I
C
= 10 mA
50 mA
100 mA
200 mA
0.6
0.4
0.2
0
0.1
0.2
0.3
0.5
0.7
1.0
2.0
3.0
5.0
7.0
10
20
30
50
I
B
, BASE CURRENT (mA)
Figure 5. Collector Saturation Region
1.2
1.0
I
C
/I
B
= 10
T
J
= 25
1.0
°
C
MAX V
BE(sat)
0.5
VC
for V
CE(sat)
(25
°
C to 125
°
C)
0.8
MIN V
BE(sat)
0
(– 55
°
C to 25
°
C)
0.6
– 0.5
0.4
MAX V
CE(sat)
– 1.0
(25
°
C to 125
°
C)
VB
for V
BE
(– 55
°
C to 25
°
C)
0.2
– 1.5
0
1.0
2.0
3.0
5.0
7.0
10
20
30
50
70
100
200
– 2.0
0
40
80
120
160
200
I
C
, COLLECTOR CURRENT (mA)
I
C
, COLLECTOR CURRENT (mA)
Figure 6. Saturation Voltage Limits
Figure 7. Temperature Coefficients
4
Motorola Small–Signal Transistors, FETs and Diodes Device Data
DYNAMIC CHARACTERISTICS
200
200
100
V
CC
= 10 V
T
J
= 25
°
C
100
I
C
/I
B
= 10
T
J
= 25
°
C
T
J
= 125
°
C
70
70
V
CC
= 10 V
50
t
d
@ V
EB(off)
= 3 V
50
30
2 V
30
20
20
V
CC
= 3 V
10
0 V
10
7.0
7.0
5.0
5.0
1.0
2.0
5.0
10
20
50
100
200
1.0
2.0
5.0
10
20
50
100
200
I
C
, COLLECTOR CURRENT (mA)
I
C
, COLLECTOR CURRENT (mA)
Figure 8. Delay Time
Figure 9. Rise Time
50
200
T
J
= 25
°
C
T
J
= 125
°
C
V
CC
= 10 V
T
J
= 25
°
C
100
30
I
C
/I
B
= 20
T
J
= 125
°
C
I
C
/I
B
= 10
70
20
50
30
I
C
/I
B
= 20
20
10
I
C
/I
B
= 10
7.0
t
s
4
t
s
– 1/8 t
f
I
B1
= I
B2
10
7.0
5.0
1.0
2.0
5.0
10
20
50
100
200
5.0
1.0
2.0
5.0
10
20
50
100
200
I
C
, COLLECTOR CURRENT (mA)
I
C
, COLLECTOR CURRENT (mA)
Figure 10. Storage Time
Figure 11. Fall Time
10
1000
MAX
TYP
700
I
C
/I
B
= 10
T
J
= 25
500
C
T
J
= 125
°
7.0
C
ibo
°
C
300
5.0
200
Q
T
100
V
CC
= 3 V
70
50
C
obo
3.0
V
CC
= 10 V
V
CC
= 3 V
Q
A
30
2.0
20
0.1
0.2
0.5
1.0
2.0
5.0
10
1.0
2.0
3.0
5.0
7.0
10
20
30
50
70
100
200
REVERSE BIAS (Vdc)
I
C
, COLLECTOR CURRENT (mA)
Figure 12. Junction Capacitance
Figure 13. Maximum Charge Data
Motorola Small–Signal Transistors, FETs and Diodes Device Data
5
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