S858TA3.pdf

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S858TA3
Cascadable Silicon Bipolar MMIC Amplifier
Electrostatic sensitive device.
Observe precautions for handling.
Applications
General purpose 50 gain block for narrow and broad
band IF and RF amplifiers in commercial and industrial
applications. The 50 level allows directly to cascade
this amplifier with minimal external circuitry, thus
providing a simple, cost effective way to achieve low
level amplification.
Features
Low noise figure (3.3 dB at 900 MHz)
Low operating voltage (6 V)
Low cost surface mount plastic package
50 cascadable gain block
Few external components
High gain (17.5 dB at 900 MHz)
2
1
3
4
94 9279
S858TA3 Marking: TA3
Plastic case (SOT 143)
1 = RF–output; 2 = Ground; 3 = RF–input; 4 = Ground
Absolute Maximum Ratings
Parameters
Symbol
Value
Unit
Device current
I bias
35
mA
RF input power
P in
+20
dBm
Total power dissipation T amb
3
60
°
C
P tot
200
mW
Junction temperature
T j
150
°
C
Storage temperature range
T stg
–65 to +150
°
C
Maximum Thermal Resistance
Parameters
Symbol
Value
Unit
Channel ambient on glass fibre printed board
(25 x 20 x 1.5) mm 3 plated with 35 m Cu
R thJA
450
K/W
TELEFUNKEN Semiconductors
Rev. A1, 18-Apr-96
1 (3)
Broadband amplification
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S858TA3
Electrical AC Characteristics
T amb = 25
C, I bias = 29 mA, Z 0 = 50 , f = 900 MHz
Parameters / Test Conditions
Symbol
Min.
Typ.
Max.
Unit
Power gain
G p
17
17.5
dB
3 dB bandwidth
f 3dB
500
MHz
Input VSWR
f = 0.1 to 2.5 GHz
VSWR
1.8:1
Output VSWR
f = 0.1 to 2.5 GHz
VSWR
1.8:1
Noise figure
f = 900 MHz
F
3.3
dB
Intermodulation distortion
22.5 mV input voltage
IM 3
50
dB
1 dB compression point
P 1dB
10
dBm
Device voltage
V d
2.9
3.6
4.3
V
Dimensions in mm
96 12240
2 (3)
TELEFUNKEN Semiconductors
Rev. A1, 18-Apr-96
°
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S858TA3
Ozone Depleting Substances Policy Statement
It is the policy of TEMIC TELEFUNKEN microelectronic GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems
with respect to their impact on the health and safety of our employees and the public, as well as their impact on
the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as
ozone depleting substances ( ODSs ).
The Montreal Protocol ( 1987 ) and its London Amendments ( 1990 ) intend to severely restrict the use of ODSs and
forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban
on these substances.
TEMIC TELEFUNKEN microelectronic GmbH semiconductor division has been able to use its policy of
continuous improvements to eliminate the use of ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively
2 . Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency ( EPA ) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C ( transitional substances ) respectively.
TEMIC can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain
such substances.
We reserve the right to make changes to improve technical design and may do so without further notice .
Parameters can vary in different applications. All operating parameters must be validated for each customer
application by the customer. Should the buyer use TEMIC products for any unintended or unauthorized
application, the buyer shall indemnify TEMIC against all claims, costs, damages, and expenses, arising out of,
directly or indirectly, any claim of personal damage, injury or death associated with such unintended or
unauthorized use.
TEMIC TELEFUNKEN microelectronic GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
Telephone: 49 ( 0 ) 7131 67 2831, Fax number: 49 ( 0 ) 7131 67 2423
TELEFUNKEN Semiconductors
Rev. A1, 18-Apr-96
3 (3)
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