29C010.pdf

(166 KB) Pobierz
AT29C010A 1-Megabit (128K x 8) 5-volt Only Flash Memory
Features
Fast Read Access Time - 70 ns
5-Volt Only Reprogramming
Sector Program Operation
– Single Cycle Reprogram (Erase and Program)
– 1024 Sectors (128 bytes/sector)
– Internal Address and Data Latches for 128 Bytes
Two 8K Bytes Boot Blocks with Lockout
Internal Program Control and Timer
Hardware and Software Data Protection
Fast S ector Program Cycle Time - 10 ms
DATA Polling for End of Program Detection
Low Power Dissipation
– 50 mA Active Current
– 100 µA CMOS Standby Current
Typical Endurance > 10,000 Cycles
Single 5V ± 10% Supply
CMOS and TTL Compatible Inputs and Outputs
Commercial and Industrial Temperature Ranges
1-Megabit
(128K x 8)
5-volt Only
Flash Memory
Description
The AT29C010A is a 5-volt-only in-system Flash programmable and erasable read
only memory (PEROM). Its 1 megabit of memory is organized as 131,072 words by 8
bits. Manufactured with Atmel’s advanced nonvolatile CMOS technology, the device
offers access times to 70 ns with power dissipation of just 275 mW over the commer-
cial temperature range. When the device is deselected, the CMOS standby current is
less than 100
AT29C010A
µA. The device endurance is such that any sector can typically be writ-
ten to in excess of 10,000 times.
(continued)
Pin Configurations
DIP Top View
Pin Name
Function
NC
A16
A15
A12
A7
A6
A5
A4
A3
A2
A1
A0
I/O0
I/O1
I/O2
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
VCC
WE
NC
A14
A13
A8
A9
A1 1
OE
A1 0
CE
I/O7
I/O6
I/O5
I/O4
I/O3
A0 - A16
Addresses
CE
Chip Enable
OE
Output Enable
WE
Write Enable
I/O0 - I/O7
Data Inputs/Outputs
NC
No Connect
TSOP Top View
Type 1
PLCC Top View
A11
A9
A8
A13
A14
NC
WE
VCC
NC
A16
A15
A12
A7
A6
A5
A4
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
OE
A1 0
CE
I/O7
I/O6
I/O5
I/O4
I/O3
GND
I/O2
I/O1
I/O0
A0
A1
A2
A3
A7
A6
A5
A4
A3
A2
A1
A0
I/O0
5
6
7
8
9
10
11
12
13
29
28
27
26
25
24
23
22
21
A14
A13
A8
A9
A1 1
OE
A1 0
CE
I/O7
Rev. 0394B–10/98
1
383691547.016.png 383691547.017.png
 
383691547.018.png
 
383691547.001.png 383691547.002.png 383691547.003.png 383691547.004.png 383691547.005.png
 
To allow for simple in-system reprogrammability, the
AT29C010A does not require high input voltages for pro-
gramming. Five-volt-only commands determine the opera-
tion of the device. Reading data out of the device is similar
to reading from an EPROM. Reprogramming the
AT29C010A is performed on a sector basis; 128 bytes of
data are loaded into the device and then simultaneously
programmed.
During a reprogram cycle, the address locations and 128
bytes of data are internally latched, freeing the address and
data bus for other operations. Following the initiation of a
program cycle, the device will automatically erase the sec-
tor and then program the latched data using an internal
co ntrol ti mer. The end of a program cycle can be detected
by DATA polling of I/O7. Once the end of a program cycle
has been detected, a new access for a read or program
can begin.
programmed during the internal programming period. After
the first data byte has been loaded into the device, succes-
sive bytes are entered in the same manner. Each new byte
to b e p rogr ammed must have its high to low transitio n on
WE (or CE) within 150
s of the last low to high transition,
the load period will end and the internal programming
period will start. A7 to A16 specify the sector address. The
sector add res s m ust be valid during each high to low transi-
tion of WE (or CE). A0 to A6 specify the byte address within
the sector. The bytes may be loaded in any order; sequen-
tial loading is not required. Once a programming operation
has been initiated, and for the duration of t WC , a read oper-
ation will effectively be a polling operation.
SOFTWARE DATA PROTECTION: A software con-
trolled data protection feature is available on the
AT29C010A. Once the software protection is enabled a
software algorithm must be issued to the device before a
program may be performed. The software protection fea-
ture may be enabled or disabled by the user; when shipped
from Atmel, the software data protection feature is dis-
abled. To enable the software data protection, a series of
three program commands to specific addresses with spe-
cific data must be performed. After the software data pro-
tection is enabled the same three program commands
must begin each program cycle in order for the programs to
occur. All software program commands must obey the sec-
tor program timing specifications. Once set, the software
data protection feature remains active unless its disable
command is issued. Power transitions will not reset the
software data protection feature, however the software fea-
ture will guard against inadvertent program cycles during
power transitions.
Once set, software data protection will remain active unless
the disable command sequence is issued.
After setting SDP, any attempt to write to the device without
the 3-byte command sequence will start the internal write
timers. No data will be written to the device; however, for
the duration of t WC , a read operation will effectively be a
polling operation.
After the software data protection’s 3-byte command code
is give n, a byt e lo ad is perfor me d b y ap plying a low pulse
on t he WE or CE input with CE or WE low (respectively)
and O E hig h. The address is latched on the falling edge of
CE or WE, whichever occu rs last . The data is latched by
the first rising edge of CE or WE. The 128 bytes of data
must be loaded into each sector by the same procedure as
outlined in the program section under device operation.
HARDWARE DATA PROTECTION: Hardware features
protect against inadvertent programs to the AT29C010A in
the following ways: (a) V CC sense—if V CC is below 3.8V
(typical), the program function is inhibited; (b) V CC power on
m
Block Diagram
Device Operation
READ : The AT2 9C010A is acce ssed like an EPROM.
When CE and OE are low and WE is high, the data stored
at the memory location determined by the address pins is
asserted on the outputs. T he ou tpu ts are put in the high
impedance state whenever CE or OE is high. This dual-line
control gives designers flexibility in preventing bus conten-
tion.
BYTE LOAD: Byte loads are used to enter the 128 bytes
of a sector to be programmed or the software codes for
data protecti on. A by te l oad is perf orm ed by a pplying a low
pulse on th e W E or CE input with CE or WE low (respec-
tively) a nd O E high . The address is latched on the falling
edge of CE or WE, whichever occ ur s la st. The data is
latched by the first rising edge of CE or WE.
PROGRAM: The device is reprogrammed on a sector
basis. If a byte of data within a sector is to be changed,
data for the entire sector must be loaded into the device.
The data in any byte that is not loaded during the program-
ming of its sector will be indeterminate. Once the bytes of a
sector are loaded into the device, they are simultaneously
2
AT29C010A
s of the low to high transition of WE
(or CE) of the preceding byte. If a high to low transition is
not detected within 150
m
383691547.006.png
AT29C010A
delay—once V CC has reached the V CC sense level, the
device will automatically time out 5 ms (typical) bef ore pro-
gra mming; (c) P rogram inhibit—holding any one of OE low,
CE high or WE high inhibits program cycles; an d (d) No ise
filter—pulses of less than 15 ns (typical) on the WE or CE
inputs will not initiate a program cycle.
PRODUCT IDENTIFICATION: The product identification
mode identifies the device and manufacturer as Atmel. It
may be accessed by hardware or software operation. The
hardware operation mode can be used by an external pro-
grammer to identify the correct programming algorithm for
the Atmel product. In addition, users may wish to use the
software product identification mode to identify the part (i.e.
using the device code), and have the system software use
the appropriate sector size for program operations. In this
manner, the user can have a common board design for
256K to 4-megabit densities and, with each density’s sector
size in a memory map, have the system software apply the
appropriate sector size.
For details, see Operating Modes (for hardware operation)
or Software Product Identification. The manufacturer and
device code is the same for both modes.
DATA POLLING: The AT29C010A features DATA poll-
ing to indicate the end of a program cycle. During a pro-
gram cycle an attempted read of the last byte loaded will
result in the complement of the loaded data on I/O7. Once
the program cycle has been completed, true data is valid
on all outputs and the next cycle may begin. DATA polling
may begin at any time during the prog ram cyc le.
TOGGLE BIT: In addition to DATA polling the
AT29C010A provides another method for determining the
end of a program or erase cycle. During a program or erase
operation, successive attempts to read data from the
device will result in I/O6 toggling between one and zero.
Once the program cycle has completed, I/O6 will stop tog-
gling and valid data will be read. Examining the toggle bit
may begin at any time during a program cycle.
OPTIONAL CHIP ERASE MODE: The entire device can
be erased by using a 6-byte software code. Please see
Software Chip Erase application note for details.
BOOT BLOCK PROGRAMMING LOCKOUT: The
AT29C010A has two designated memory blocks that have
a programming lockout feature. This feature prevents pro-
gramming of data in the designated block once the feature
has been enabled. Each of these blocks consists of 8K
bytes; the programming lockout feature can be set inde-
pendently for either block. While the lockout feature does
not have to be activated, it can be activated for either or
both blocks.
These two 8K memory sections are referred to as boot
blocks. Secure code which will bring up a system can be
contained in a boot block. The AT29C010A blocks are
located in the first 8K bytes of memory and the last 8K
bytes of memory. The boot block programming lockout fea-
ture can therefore support systems that boot from the lower
addresses of memory or the higher addresses. Once the
programming lockout feature has been activated, the data
in that block can no longer be erased or programmed; data
in other memory locations can still be changed through the
regular programming methods. To activate the lockout fea-
ture, a series of seven program commands to specific
addresses with specific data must be performed. Please
see Boot Block Lockout Feature Enable Algorithm.
If the boot block lockout feature has been activated on
either block, the chip erase function will be disabled.
BOOT BLOCK LOCKOUT DETECTION: A software
method is available to determine whether programming of
either boot block section is locked out. See Software Prod-
uct Identification Entry and Exit sections. When the device
is in the software product identification mode, a read from
location 00002 will show if programming the lower address
boot block is locked out while reading location FFFF2 will
do so for the upper boot block. If the data is FE, the corre-
sponding block can be programmed; if the data is FF, the
program lockout feature has been activated and the corre-
sponding block cannot be programmed. The software prod-
uct identification exit mode should be used to return to
standard operation.
Absolute Maximum Ratings*
Temperature Under Bias ................................ -55 ° C to +125 ° C
*NOTICE: Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent dam-
age to the device. This is a stress rating only and
functional operation of the device at these or any
other conditions beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect
device reliability.
Storage Temperature ..................................... -65 ° C to +150 ° C
All Input Voltages (including NC Pins)
with Respect to Ground ...................................-0.6V to +6.25V
All Output Voltages
with Respect to Ground .............................-0.6V to V CC + 0.6V
Voltage on OE
with Respect to Ground ...................................-0.6V to +13.5V
3
383691547.007.png
DC and AC Operating Range
AT29C010A-70
AT29C010A-90
AT29C010A-12
AT29C010A-15
Operating
Temperature (Case)
Com.
0 ° C - 70 ° C
0 ° C - 70 ° C
0 ° C - 70 ° C
0 ° C - 70 ° C
Ind.
-40 ° C - 85 ° C
-40 ° C - 85 ° C
-40 ° C - 85 ° C
V CC Power Supply
5V ± 5%
5V ± 10%
5V ± 10%
5V ± 10%
Operating Modes
Mode
CE
OE
WE
Ai
I/O
Read
V IL
V IL
V IH
Ai
D OUT
Program (2)
V IL
V IH
V IL
Ai
D IN
5V Chip Erase
V IL
V IH
V IL
Ai
Standby/Write Inhibit
V IH
X (1)
X
X
High Z
Program Inhibit
X
X
V IH
Program Inhibit
X
V IL
X
Output Disable
X
V IH
X
High Z
Product Identification
Hardware
V IL
V IL
V IH
A1 - A16 = V IL , A9 = V H , (3) A0 = V IL
Manufacturer Code (4)
A1 - A16 = V IL , A9 = V H , (3) A0 = V IH
Device Code (4)
Software (5)
A0 = V IL
Manufacturer Code (4)
A0 = V IH
Device Code (4)
Notes: 1. X can be V IL or V IH .
2. Refer to AC Programming Waveforms.
3. V H = 12.0V
±
0.5V.
4. Manufacturer Code: 1F, Device Code: 5D.
5. See details under Software Product Identification
Entry/Exit.
DC Characteristics
Symbol
Parameter
Condition
Min
Max
Units
I LI
Input Load Current
V IN = 0V to V CC
10
m A
I LO
Output Leakage Current
V I/O = 0V to V CC
10
m A
0° - 40°C
30
m A
I SB1
V CC Standby Current CMOS CE = V CC - 0.3V to V CC
Com.
100
m A
Ind.
300
m A
I SB2
V CC Standby Current TTL
CE = 2.0V to V CC
3
mA
I CC
V CC Active Current
f = 5 MHz; I OUT = 0 mA
50
mA
V IL
Input Low Voltage
0.8
V
V IH
Input High Voltage
2.0
V
V OL
Output Low Voltage
I OL = 2.1 mA
0.45
V
V OH1
Output High Voltage
I OH = -400 m A
2.4
V
V OH2
Output High Voltage CMOS
I OH = -100 m A; V CC = 4.5V
4.2
V
4
AT29C010A
383691547.008.png
AT29C010A
AC Read Characteristics
AT29C010A-70 AT29C010A-90 AT29C010A-12 AT29C010A-15
Symbol Parameter
Min
Max
Min
Max
Min
Max
Min
Max
Units
t ACC
Address to Output Delay
70
90
120
150
ns
t CE (1)
CE to Output Delay
70
90
120
150
ns
t OE (2)
OE to Output Delay
0
35
0
40
0
50
0
70
ns
t DF (3)(4)
CE or OE to Output Float
0
25
0
25
0
30
0
40
ns
t OH
Output Hold from OE, CE or
Address, whichever occurred first
0
0
0
0
ns
AC Read Waveforms (1)(2)(3)(4)
Notes: 1. CE may be delayed up to t ACC - t CE after the address tran sitio n without impact on t ACC .
2. OE may be delayed up to t CE - t OE after the falling edge of CE without impact on t CE or by t ACC - t OE after an address change
without impact on t A CC .
3. t DF is specified from OE or CE whichever occurs first (CL = 5 pF).
4. This parameter is characterized and is not 100% tested.
Input Test Waveforms and
Measurement Level
Output Test Load
70 ns
90/120/150 ns
t R , t F < 5 ns
Pin Capacitance
f = 1 MHz, T = 25°C (1)
Symbol
Typ
Max
Units
Conditions
C IN
4
6
pF
V IN = 0V
C OUT
8
12
pF
V OUT = 0V
Note: 1. This parameter is characterized and is not 100% tested.
5
383691547.009.png 383691547.010.png 383691547.011.png 383691547.012.png 383691547.013.png 383691547.014.png 383691547.015.png
Zgłoś jeśli naruszono regulamin