Andes.pdf

(1369 KB) Pobierz
untitled
Service Manual
for PDA PHONE II
Andes
HTC Proprietary
Confidential Treatment Requested
Rev. 2.0
Jan 5 , 2005
HTC Corp.
Engineering Mobility
HTC confidential
© 2001, HTC Corporation. All rights reserved.
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TITLE: Service Manual for PDA PHONE II
REV.
NO.
DATE
CONTENTS
DEP.
REVISED
APP ´ D STGE.PER.
1.0 Oct 06,2003
TSD
Henry_Lai
1.5 Oct 13,2003
TSD
Henry_Lai
1.6 Oct 20,2003
TSD
Henry_Lai
1.7
Nov
07,2003
TSD
Henry_Lai
1.8 Dec 22,2003
TSD
Henry_Lai
1.9 2004/6/3
Camera defect to lead to
audio function( P64)
TSD
HB_Chen
2.0 2005/1/26
Leakage current
measurement
TSD
HB_Chen
HTC confidential
© 2001, HTC Corporation. All rights reserved.
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Table of contents
1. I NTRODUCTION ··································································································· 5
2. P RODUCT S PECIFICATIONS ·············································································· 5
2.1P RODUCT C ONFIGURATION ··············································································· 5
2.2S PECIFICATIONS OF PDA PHONE II ································································ 6
2.3S PECIFICATIONS OF AC A DAPTER …………………………………………………6
2.4 GSM/GPRS F UNCTIONAL B LOCK PART ······················································ 6
3. S YSTEM B LOCK D IAGRAM ····················································································· 11
4. L ABELING ············································································································· 12
5. S ERVICING T OOLS ································································································ 14
6. A SSEMBLING AND D ISASSEMBLING ········································································ 15
6.1D ISASSEMBLING ····························································································· 15
6.2A SSEMBLING ·································································································· 22
6.3 Camera Replacement assembly ……………………………………………… 29
6.4 Connector, Back up battery replacement ……………………………………. 30
7. P ROBLEM D IAGNOSTICS ················································································· 31
7.1L IST OF T EST J IGS ························································································· 31
7.2H/W REQUIREMENT FOR PC··········································································· 31
7.3S OFTWARE REQUIREMENT ············································································ 31
8. D IAGNOSTIC P ROGRAMS ·············································································· 32
8.1L IST OF T EST I TEMS ······················································································ 32
8.2 T EST I TEMS O PERATION ················································································· 32
9. B ATTERY T EST /J UDGEMENT PROCEDURE ······························································ 36
10.LCM I NSPECTION C RITERIA ················································································· 41
11.RF ···················································································································· 43
11.1 RF T EST R EQUIREMENT ··············································································· 43
11.2 RF TEST PICTURE ······················································································ 43
11.3 RF A NTENNA T EST S PEC . ············································································ 44
12. OS U PGRADE AND GSM CODE U PGRADE ··························································· 46
12.1 RUU········································································································· 47
12.2 RSU ······································································································· 47
12.3 C OMPLETE P ROCEDURE FOR SD REFLASH ············································ 51
1 2.4 Procedure for Unit Re-flash 56
13. C LASSIFICATION OF N ON C ONFIRMITY ································································· 58
14.T ROUBLE SHOOTING AND R EPAIR ········································································· 59
15 E XPLODED D IAGRAMS & S PARE P ART L IST ··························································· 65
HTC confidential
© 2001, HTC Corporation. All rights reserved.
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15.1 Exploded Diagrams…………………………………………………………….. 65
15.2 L IST OF S PAR P ARTS ······················································································ 66
15.3 Spare Parts list with picture 67
14.A PPENDIX ········································································································ 70
A.C USTOMER , R ETAILER M ISJUDGMENT ······························································ 70
B. Repair Trouble Shooting Guide 73
4END …………………………………………………………………………..73
HTC confidential
© 2001, HTC Corporation. All rights reserved.
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1.Introduction
This manual provides the technical information to support the service activities of the PDA
PHONE II.
This document contains highly confidential information, so any or all of this
document should not be revealed to any third party.
2. Product Specifications
2.1 Product Configuration
Standard Package
ITEM
CONTAINS
1
Main Unit
2
USB Cradle
3
Stylus
4
AC Adapter
5
Earphone
6
Pouch, Leather Case
7
Service Kit
8
Quick Start Guide
9
User’s Manual
10
Battery Pack
HTC confidential
© 2001, HTC Corporation. All rights reserved.
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