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ISSUE N°8
JANuAry 2013
POWER
dev’
Connecting the Power Electronic Supply
INdustry revIew
IGBT producers
adapt to vibrant
market
COMPANy INsIGHt
Power Integrations:
Reliability and
quality drive IGBT
modules
ANALyst COrNer
IGBT developments
face off against
weak economy
Free subscription on
www.i-micronews.com
4
th
-5
th
March 2013 Sheraton Frankfurt Airport, Germany
Bringing together leading Compound Semiconductor
industry insiders
Gain a comprehensive overview of the entire compound
semiconductor industry-the must attend event for 2013
is the 3
rd
CS International conference in Germany, at the
Sheraton Frankfurt Airport on 4
th
-5
th
March 2013.
Delegates will have the unique opportunity to network
with leading industry professionals of the III-V chip making
industry, interact with suppliers and industry experts who will
deliver the latest research, business models, and insights.
Chaired by
Keynote speaker
Dr Andrew Nelson, IQE
President and Chief Executive Oficer
Conference Chair
Dr Wilman Tsai, Intel Corporation
Program Manager of Technology Manufacturing
III-V CMOS for High Performance and Low Power
Logic Devices
Speakers
Asif Anwar -
Strategy Analytics
Dr Markus Behet -
Dow Corning Corporation
Bryan Bothwell -
TriQuint Semiconductor
Michelle Bourke -
Oxford Instruments
Ms Ann Hughes -
SAFC
Daniel Cline -
Lux Research Inc
Marianne Germain -
EpiGaN
Malcolm Harrower -
Indium
Dr Schang-jing Hon -
Epistar Corporation
Allan Jaunzens -
Evatec
Dr Rainer Krause -
Soitec
Dr Michael Lebby -
Translucent Inc
Noriyuki Matsubara -
Panasonic Europe
AJ Nadler -
RF Micro Devices (RFMD)
Pars Mukish -
Yole Développement
Dr Philippe Roussel -
Yole Développement
Dr Vijit Sabnis -
Solar Junction
Dr Frank Schulte -
Aixtron
Dr Ertugrul Sönmez -
MicroGaN
Dr Elisabeth Steimetz -
LayTec AG
Gunnar Stolze -
Oclaro Inc
Dr Thomas Uhrmann -
EV Group
Gregg Wallace -
Temescal
Professor Tao Wang -
Seren Photonics
Dr Tudor Williams -
Mesuro Ltd
Dr YiFeng Wu -
Transphorm
Erwin Ysewijn -
Azzurro
All speakers and presentations are subject to change
Please visit
www.cs-international.net
for further information
or register at:
www.cs-international.net/registration
Platinum Sponsors
Gold Sponsors
JANuAry 2013
ISSUE N°8
edItOrIAL
Happy and successful 2013!
Yole Développement would like to begin this year’s irst Power Dev’ edition by offering its
best wishes to all its readers for a successful 2013 in the Power Electronics industry!
In this issue, we’re proud to present and discuss the bright future of Power Electronics
by focusing on the industry’s key device: IGBTs.
We had the opportunity to interview a group of important Power Semiconductor
industry players, who – even though new materials such as siC and GaN have begun
appearing on the market – are still pushing for silicon developments. These players
include Alpha Omega Semiconductor, Mitsubishi Electric, ON Semiconductor, ABB,
Dynex Semiconductor, BYD (the Chinese leader) and Power Integrations, and all of
them are deeply involved in IGBT technology improvements; in fact, some are also
working also on alternative high-performance materials and devices.
After a tough and uncertain 2012, it’s very encouraging to see that last year’s demons
have been chased away and the industry is growing again. Indeed, Yole Développement’s
most recent analysis had shown a downturn for dedicated applications, especially the
cost driven ones. On top of that, some governments had reduced or ceased their
incentives, and strong competition was coming from developing countries like China
and Russia – and all of this in the midst of a global economic crisis.
...After a tough and
uncertain 2012, it’s
very encouraging to
see that the industry
is growing again...
Thankfully, the majority of players managed to survive through different strategies
(M&A, vertical integration, diversiication, or simply focusing on creating an essential
and proitable business), and are now looking to:
• Focus on attractive applications, like transportation and renewable energies
• Integrate themselves along the supply chain: device makers are becoming
module manufacturers and system integrators are becoming interested in power
semiconductors
• Target dynamic locations such as Asia, Eastern Europe and South America
This comes as a relief to the Power Semiconductor business, especially silicon – and
especially IGBTs, which were pushed into the background a bit by Super Junction and
SiC MOSFETs, and GaN HFETs. But IGBT is alive and kicking, and between discrete and
modules IGBTs are close to a $3 billion market. Furthermore, industry leaders are very
interested in developing new IGBT generations with higher performance, including:
• Smaller footprint and thinner dies
• Faster switching frequency
• Advanced packaging and cooling solutions
• Smart drivers, and combination with other devices
And this is just the beginning: materials are improving, the value chain is becoming
increasingly consolidated, standards are starting to appear and the overall industry
is conident.
eveNts
• APEC - The Applied Power Electronics
Conference and Exposition
March 17 to 21, 2013 – Long Beach, CA – USA
Yole Développement is conident too!
• SSF 2013
April 10 to 12, 2013 – Paris, France
2013 looks global. 2013 looks challenging. 2013 looks bright.
Here’s to a happy and successful 2013!
• PCIM Europe
May 14 to 16, 2013 – Nuremberg, Germany
Brice Le Gouic
Activity Leader, Power electronics
yole développement
legouic@yole.fr
• PCIM Asia
June 18 to 20, 2013 – shanghai, China
PLATINUM PARTNERS:
For more information, please contact S. Leroy (leroy@yole.fr)
3
POWER
dev’
january 2013
ISSUE N°8
COnTEnTS
INDUSTRY REVIEW
6
IGBT producers adapt to vibrant market
YOLE ASKS
10
Power Integrations: reliability and quality drive IGBT modules
COMPANY INSIGHT
12
Mitsubishi Electric: Low loss IGBT modules are system makers’ gain
International Rectiier: Thin wafers propel motor drive IGBTs along eficiency path
Courtesy of Dr Eric Mounier
ANALYST CORNER
16
IGBT developments face off against weak economy
2013 EVENT REVIEW
20
FROM I-MICRONEWS.COM
Please visit our website to discover the
last top stories in Power Electronics and
Compound Semiconductors:
Stay connected with your peers
on i-Micronews.com
• HexaTech awarded ARPA-E contract for
AlN substrates for high voltage power
electronics
• Semikron acquire all shares in electric
and hybrid car drives developer Compact
Dynamics
• Microsemi expands silicon carbide (SiC)
power module product family
With 20,000 monthly visitors,
i-Micronews.com provides for Power
Electronics area: current news, market
& technological analysis, key leader
interviews, webcasts section, reverse
engineering / costing, events calendar,
latest reports…
GOLD ParTnErS:
4
POWER
Dev’
International Exhibition and Conference
for Power Electronics, Intelligent Motion,
Renewable Energy and Energy Management
Nuremberg, 14 – 16 May 2013
Powerful?
…then you are right here!
The marketplace for developers and innovators.
Future starts here!
More information at
+49 711 61946-0
pcim@mesago.com
or
pcim-europe.com
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