SPI-336-99-T1.pdf

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385287057 UNPDF
Ordering number : EN6030
SPI-336-99-T1
Infrared LED
SPI-336-99-T1
Ultraminiature photoreflector supporting reflow soldering
(Single transistor type)
Features
·
Infrared LED plus Phototransistor (single)
·
DIP type
·
Compact type : 3.4 (L)
5
2.7 (W)
5
1.5 (H) mm
·
Visible light cut type
·
Taping type
Absolute Maximum Ratings at Ta=25
°
C, 65%RH (as per JIS C7032)
Parameter
Symbol
Rating
Unit
Forward Current
I F
50
mA
Input LED
Reverse Voltage
V R
5
V
Power Dissipation
P D
70
mW
Collector-Emitter Voltage
V CEO
20
V
Output
Emitter-Collector Voltage
V ECO
5
V
Phototransistor
Collector Curren
I C
20
mA
Power Dissipation
P C
70
mW
Operating Temperature
Topr
--20 to +80
°
C
Storage Temperature
Tstg
--30 to +100
°
C
Electro-Optical Characteristics at Ta=25
°
C, 65%RH
Parameter
Symbol
Condition
Min.
Typ.
Max.
Unit
Input
Forward Voltage
V F
I F =10mA
1.0
1.2
1.6
V
Reverse Current
I R
V R = 5 V
--
--
1 0
m
A
Output
Dark Current
I CEO
I F =0mA, V CE =10V
--
--
200
nA
Collector Output
I C
I F =10mA, V CE =5V * 1
80
--
1100
m
A
Leakage Current
I LEAK
I F =10mA, V CE =5V * 2
--
--
1
m
A
Coupled
Collector Emitter
V CE (sat) I F =10mA, I C =50
m
A
--
--
0.5
V
Rise Time
tr
V CC =5V, R L =100
W
--
5
--
m
s
Fall Time
tf
I C =1mA
--
5
--
m
s
* 1 Location of reflector is shown in Fig. 1.
AL V.E. film
Glass plate (t=1mm)
* 2 No reflector
Fig. 1 Location of Reflector
* 3 Table of Classification of Collector Output
Class
A
B
C
D
Ic (
m
A)
1100 to 450 600 to 260 350 to 150
200 to 80
SANYO Electric Co.,Ltd. Semiconductor Company
TOKYO OFFICE Tokyo Bldg., 1-10, 1 Chome, Ueno, Taito-ku, TOKYO, 110-8534 JAPAN
72199 GI, ( MI )
No.6030 1/6
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SPI-336-99-T1
Typical Characteristics
CAUTION
These numerical value show the electrical and optical characteristics of this product, and not assure this contents.
Forward Current vs. Ambient Temperature
Power Dissipation vs. Ambient Temperature
60
(Rating)
120
(Rating)
50
100
40
80
30
60
20
40
10
20
0
0
--25
0
25
50
75
100
--25
0
25
50
75
100
Ambient Temperature Ta (°C)
Ambient Temperature Ta (°C)
Forward Current vs. Forward Voltage
Collector vs. Forward Current
500
500
C
50°C
25°C
°
V CE =5V
Ta=25
°
C
400
100
50
C
--25°C
°
300
10
200
5
100
1
0
0
0.5
1
1.5
2
0
4
8
12
16
20
Forward Voltage V F (V)
Forward Current I F (mA)
Collector Current vs. Collector-emitter Voltage
Relative Collector Current vs. Ambient Temperature
1000
140
Ta=25
°
C
I F =10mA
V CE =5V
800
120
600
I F =20mA
100
15mA
400
80
10mA
200
60
5mA
0
40
0
5
10
--25
0
25
50
75
100
Collector-emitter Voltage V CE (V)
Ambient Temperature Ta (°C)
No.6030 2/6
Ta=75
0
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SPI-336-99-T1
Typical Characteristics
CAUTION
These numerical value show the electrical and optical characteristics of this product, and not assure this contents.
Collector-emitter Saturation Voltage vs.
Ambient Temperature
Collector Dark Current vs. Ambient Temperature
10 -6
5
0.24
I F =10mA
I C =50µA
V CE =10V
0.22
10 -7
5
0.20
0.18
10 -8
5
10 -9
0.16
5
0.14
10 -10
--25
0
25
50
75
100
--25
0
25
50
75
100
Ambient Temperature Ta (°C)
Ambient Temperature Ta (°C)
Response Time vs. Load Resistance
Test Circuit for Response Time
1000
500
I FP =20mA
V CC =5V
Ta=25°C
tf
I FP
V CC
100
tr
I FP
50
V out
tr
tf
R D
R L
10
90%
5
V out
10%
1
0.1
0.5 1
5
10
50 100
Load Resistance R L (k½ )
Relative Collector Current vs. Distance
Relative Collector Current vs.
PPC paper Moving Distance
120
120
I F =10mA
V CE =5V
Ta=25°C
2
I F =10mA,V CE =5V
Ta=25°C,d=1mm
100
100
80
80
–
0
+
60
60
1
–
1
40
40
0
+
20
20
0
0
-- 4
0
1
2
3
4
5
-- 2
0
2
4
6
Distance between sensor and Al evaporation d (mm)
PPC paper Moving Distance (mm)
No.6030 3/6
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SPI-336-99-T1
2
Pin connection
1. LED Anode
2. LED Cathode
3 .Ph. Tr Collector
4. Ph. Tr Emitter
1.6
Pin No.
1
4
2
3
0.6
0.4
4.3 ± 0.5
3.4
(3.47)
2.7
Tolerance : ± 0.2
Unit
No.6030 4/6
: mm
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SPI-336-99-T1
Package dimensions and Pin connection
As stated in the sttached paper. (No.6030 4/6)
Soldering conditions
(1) Reflow soldering
The temperature of the reflow furnace is to be set in accordance with the following temperature profile.
Soldering must be done only two time.
Temperature
: On the topsurface of product
Reflow type
: Hot air
Max 240
C
200
C
Max 165 ° C
Max 120sec
Max 10sec
Max 60sec
(2) Manusl soldering
Temperature
: Max. 290
°
C (Soldering iron tip temperature)
0.5mm
0.5mm
Time
: Max. 3 sec
Clearance
: Min. 0.5mm from package
PRECAUTIONS
(1) Bending a lead should avoid. However, when bending is necessary, take care the next items.
q Bending a lead must be done before soldering.
w Bending a lead must be done in the states of fixing leads and no stress for the regin part. Because it is possible that
stress for the regin part cause troubles such as gold wire breaking and so on.
e A lead must be bend at intervals of 0.5mm from the case edge.
r Do not bend the same position of leads more than twice.
(2) The hole pitch of a circuit board must fit to the lead pitch.
(3) Take core the following when soldering.
q Do not heat a product under any stress (a twist and so on) to leads.
w Do not heat a product in the states of operating force to the regin part.
(4) Use the flux which contain no chlorine, have no corrosion and do not need washing.
(5) Be careful that flux or other chemicals do not attach to the luminous surface and passive surface.
(6) Precautions of the product after the open dry packing
q The product after the open dry packing should be stored in the dry packing again.
The product should be kept under the conditions below, if the product is not stored in the dry paking.
Temperature
: 5 to 30
°
C, 10 to 20Hr
(7) The reflow conditions must be confirmed that no problem by your reflow furnace.
±
5
°
No.6030 5/6
°
°
C
Humidity : Max 70%RH
Term : Max 7days
w The product to be out the term without dry packing must be practiced baking.
Baking conditions : +60
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