MOC2A60.pdf

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SEMICONDUCTOR TECHNICAL DATA
Order this document
by MOC2A60–10/D
E
2 Amp Zero–Cross Triac Output
*Motorola Preferred Device
This device consists of a gallium arsenide infrared emitting diode optically
coupled to a zero–cross triac driver circuit and a power triac. It is capable of
driving a load of up to 2 amps (rms) directly, on line voltages from 20 to 280 volts
ac (rms).
•
Provides Normally Open Solid State AC Output with 2 Amp Rating
•
70 Amp Single Cycle Surge Capability
OPTOISOLATOR
2 AMP ZERO CROSS
TRIAC OUTPUT
600 VOLTS
•
Zero–Voltage Turn–on and Zero–Current Turn–off
•
High Input–Output Isolation of 3750 vac (rms)
•
Static dv/dt Rating of 400 Volts/ m s Guaranteed
•
2 Amp Pilot Duty Rating Per UL508 117 (Overload Test)
and 118 (Endurance Test)
[File No. 129224]
•
CSA Approved [File No. CA77170–1].
•
SEMKO Approved Certificate #9507228
•
Exceeds NEMA 2–230 and IEEE472 Noise Immunity Test Requirements (See Fig.14)
7
9
CASE 417–02
Style 2
PLASTIC PACKAGE
2 3
DEVICE RATINGS (T A = 25 ° C unless otherwise noted)
Rating
Symbol
Value
Unit
INPUT LED
Forward Current — Maximum Continuous
I F
50
mA
CASE 417A–02
Style 1
PLASTIC PACKAGE
Forward Current — Maximum Peak
(PW = 100
I F (pk)
1.0
A
m
s, 120 pps)
Reverse Voltage — Maximum
V R
6.0
V
OUTPUT TRIAC
Output Terminal Voltage — Maximum Transient (1)
V DRM
600
V(pk)
CASE 417B–01
Style 1
PLASTIC PACKAGE
Operating Voltage Range — Maximum Continuous
(f = 47 – 63 Hz)
V T
20 to 280
Vac(rms)
On–State Current Range
(Free Air, Power Factor . 0.3)
I T (rms)
0.03 to 2.0
A
Non–Repetitive Single Cycle Surge Current —
Maximum Peak (t = 16.7 ms)
I TSM
70
A
DEVICE SCHEMATIC
Main Terminal Fusing Current (t = 8.3 ms)
I 2 T
26
A 2 sec
7
Load Power Factor Range
PF
0.3 to 1.0
—
Junction Temperature Range
T J
– 40 to 125
C
3
TOTAL DEVICE
Input–Output Isolation Voltage — Maximum (2)
47 – 63 Hz, 1 sec Duration
2
ZVA
*
V ISO
3750
Vac(rms)
9
Thermal Resistance — Power Triac Junction to Case
(See Fig. 15)
R
q JC
8.0
° C/W
* Zero Voltage Activate Circuit
Ambient Operating Temperature Range
T oper
– 40 to +100
° C
Storage Temperature Range
T stg
– 40 to +150
° C
1, 4, 5, 6, 8. NO PIN
2. LED CATHODE
3. LED ANODE
7. MAIN TERMINAL 2
9. MAIN TERMINAL 1
Lead Soldering Temperature — Maximum
(1/16 , from Case, 10 sec Duration)
T L
260
° C
1. Test voltages must be applied within dv/dt rating.
2. Input–Output isolation voltage, V ISO , is an internal device dielectric breakdown rating. For this
2. test, pins 2, 3 and the heat tab are common, and pins 7 and 9 are common.
POWER OPTO is a trademark of Motorola, Inc.
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 2
W
Motorola Optoelectronics Device Data
1
°
Motorola, Inc. 1995
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ELECTRICAL CHARACTERISTICS (T A = 25
°
C unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
INPUT LED
Forward Voltage (I F = 10 mA)
V F
1.00
1.17
1.50
V
Reverse Leakage Current (V R = 6.0 V)
I R
—
1.0
100
m A
Capacitance
C
—
18
—
pF
OUTPUT TRIAC
Off–State Leakage, Either Direction
(I F = 0, V DRM = 600 V)
I DRM
—
0.25
10
m A
Critical Rate of Rise of Off–State Voltage (Static)
V in = 400 vac(pk)) (1)(2)
dv/dt(s)
400
—
—
V/ m s
Holding Current, Either Direction (I F = 0, V D = 12 V, I T = 200 mA)
I H
—
10
—
mA
COUPLED
LED Trigger Current Required to Latch Output MOC2A60–10
Either Direction (Main Terminal Voltage = 2.0 V) (3)(4) MOC2A60–5
I FT (on)
I FT (on)
—
—
7.0
3.5
10
5.0
mA
mA
On–State Voltage, Either Direction (I F = Rated I FT (on), I TM = 2.0 A)
V TM
—
0.96
1.3
V
Inhibit Voltage, Either Direction (I F = Rated I FT (on)) (5)
(Main Terminal Voltage above which device will not trigger)
V INH
—
8.0
10
V
Commutating dv/dt (Rated V DRM , I T = 30 mA – 2.0 A(rms),
T A = – 40
dv/dt (c)
5.0
—
—
V/
m
S
±
100
°
C, f = 60 Hz) (2)
Common–mode Input–Output dv/dt (2)
dv/dt(cm)
—
40,000
—
V/
m
S
Input–Output Capacitance (V = 0, f = 1.0 MHz)
C ISO
—
1.3
—
pF
Isolation Resistance (V I–O = 500 V)
R ISO
10 12
10 14
—
W
1. Per EIA/NARM standard RS–443, with V P = 200 V, which is the instantaneous peak of the maximum operating voltage.
2. Additional dv/dt information, including test methods, can be found in Motorola applications note AN1048/D, Figure 43.
3. All devices are guaranteed to trigger at an I F value less than or equal to the max I FT . Therefore, the recommended operating I F lies between
3. the device’s maximum I FT (on) limit and the Maximum Rating of 50 mA.
4. Current–limiting resistor required in series with LED.
5. Also known as “Zero Voltage Turn–On.”
TYPICAL CHARACTERISTICS
100
2.00
PULSE ONLY
PULSE OR DC
1.80
80
1.60
60
1.40
40
T A = – 40 ° C
1.20
20
1.00
25 ° C
100 ° C
0
0.80
–40
–20
0
20
40
60
80
100
120
1
10
100
1000
T A , AMBIENT TEMPERATURE (
°
C)
I F , FORWARD CURRENT (mA)
Figure 1. Maximum Allowable Forward LED
Current versus Ambient Temperature
Figure 2. LED Forward Voltage
versus LED Forward Current
2
Motorola Optoelectronics Device Data
384511044.005.png 384511044.006.png
1.60
2.4
1.50
2.0
1.40
WORST CASE UNIT
NORMALIZED TO
T A = 25
1.30
1.6
°
C
1.20
1.2
1.10
0.8
1.00
0.90
0.4
0.80
0.0
–40
–20
0
20
40
60
80
100
120
–40
–20
0
20
40
60
80
100
120
T A , AMBIENT TEMPERATURE (
°
C)
T A , AMBIENT TEMPERATURE (
°
C)
Figure 3. Forward LED Trigger Current
versus Ambient Temperature
Figure 4. Maximum Allowable On–State RMS Output
Current (Free Air) versus Ambient Temperature
2.20
2.5
2.00
PULSE ONLY
PULSE OR DC
2.0
1.80
1.60
1.5
1.40
MAXIMUM
1.20
1.0
1.00
MEAN
T J = 25
°
C
0.5
0.80
0.60
100
°
C
0.0
0.03
0.1
1.0
0.01
0.1
1.0
10
I TM , INSTANTANEOUS ON–STATE CURRENT (A)
I T , MAIN TERMINAL CURRENT (A)
Figure 5. On–State Voltage Drop versus
Output Terminal Current
Figure 6. Power Dissipation
versus Main Terminal Current
120
100
T A = 25 ° C
100
NORMALIZED TO
T A = 25 ° C
10
80
60
1.0
40
0.1
20
0.01
0.1
1
10
0.01
– 40
– 20
0
20
40
60
80
100
120
I T , MAIN TERMINAL CURRENT (A)
Figure 7. Junction Temperature versus Main
Terminal RMS Current (Free Air)
T A , AMBIENT TEMPERATURE ( ° C)
Figure 8. Leakage with LED Off versus
Ambient Temperature
Motorola Optoelectronics Device Data
3
0
384511044.007.png 384511044.008.png
2.00
1.80
1.60
1000
STATIC
NORMALIZED TO
T A = 25 ° C
1.40
100
1.20
1.00
0.80
0.60
10
COMMUTATING
0.40
0.20
I T = 30 mA – 2A(RMS)
F = 60 Hz
0.00
– 40
– 20
0
+ 25
+ 40
+ 60
+ 80
+ 100
0
– 40 – 20
0
40
T A , AMBIENT TEMPERATURE (
20
60
80
100
120
T A , AMBIENT TEMPERATURE (
C)
°
C)
Figure 9. Holding Current versus
Ambient Temperature
Figure 10. dv/dt versus Ambient Temperature
LED INPUT
VOLTAGE
PIN 7 TO 9
TURN ON
POINTS
Figure 11. Operating Waveforms
MOC2A60
Select the value of R1 according to the following formulas:
[1] R1 = (V CC – V F ) / Max. I FT (on) per spec.
[2] R1 = (V CC – V F ) / 0.050
Typical values for C1 and R2 are 0.01
V CC
R2
MOV
, respec-
tively. You may adjust these values for specific applications.
The maximum recommended value of C1 is 0.022
m
F and 39
W
R1
C1
F. See
application note AN1048 for additional information on com-
ponent values.
The MOV may or may not be needed depending upon the
characteristics of the applied ac line voltage. For applica-
tions where line spikes may exceed the 600 V rating of the
MOC2A60, an MOV is required.
m
ZVA
*
LOAD
*ZERO VOLTAGE ACTIVATE CIRCUIT
Figure 12. Typical Application Circuit
4
Motorola Optoelectronics Device Data
°
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Use care to maintain the minimum spacings as shown.
Safety and regulatory requirements dictate a minimum
of 8.0 mm between the closest points between input
and output conducting paths, Pins 3 and 7. Also, 0.070
inches distance is required between the two output
Pins, 7 and 9.
Keep pad sizes on Pins 7 and 9 as large as possible
for optimal performance.
0.070
,
MIN
0.315 , MIN
[8 MM MIN]
Figure 13. PC Board Layout Recommendations
DEVICE UNDER TEST
NOISE
SOURCE
Each device, when installed in the circuit shown
in Figure 14, shall be capable of passing the fol-
lowing conducted noise tests:
2
3
7 9
AC
SUPPLY
•
IEEE 472 (2.5 KV)
•
Lamp Dimmer (NEMA Part DC33, 3.4.2.1)
10 W
MOV
•
NEMA ICS 2–230.45 Showering Arc
150V
I F = RATED I F
0.022 m F
Z LOAD
•
MIL–STD–461A CS01, CS02 and CS06
Figure 14. Test Circuit for Conducted Noise Tests
NO ADDITIONAL HEATSINK
{
T J
T C
T A
}
JUNCTION
TEMPERATURE OF
MOC2A60 . . .
OUTPUT CHIP
R
q JC
R
q CA
HEAT F LOW
AMBIENT AIR
TEMPERATURE
WITH ADDITIONAL HEATSINK
T J
T C
T S
T A
R
q JC
R
q CS
R
q SA
Terms in the model signify:
T A = Ambient temperature
T S = Optional additional
T S = heat sink temperature
T C = Case temperature
T J = Junction temperature
P D = Power dissipation
R
q
SA = Thermal resistance, heat sink to ambient
R
CA = Thermal resistance, case to ambient
q
R
q
CS = Thermal resistance, heat sink to case
R
q
JC = Thermal resistance, junction to case
q JC
are referenced to the point on
the heat tab indicated with an
‘X’. Measurements should be
taken with device orientated
along its vertical axis.
Values for thermal resistance components are: R
q CA = 36 ° C/W/in maximum
q JC = 8.0 ° C/W maximum
The design of any additional heatsink will determine the values of R
q SA and R
q CS .
T C – T A = P D (R
q CA )
T C – T A = P D (R
q
JC ) + R
q
SA ), where P D = Power Dissipation in Watts.
Figure 15. Approximate Thermal Circuit Model
Motorola Optoelectronics Device Data
5
Thermal measurements of R
Values for thermal resistance components are: R
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